Ürün No. 27401
SLP CS-30
Ürün varyantları
Broşürler
Uygulama Alanları
- Mould control and prevention in existing buildings
- Implementation of the hygienic minimum heat insulation level in existing buildings
- Improving the room climate by increasing the wall surface temperature
Özellikler
- Thermally insulating and mould inhibiting
- Enables water vapour diffusion
- Capillary-active
- Free from quartz sands and quartz powders
- Thermal conductivity (nominal value) approx. 0.07 W/(m*K)
- Reaction to fire class A1 (non-combustible)
- Low construction height
- Substrate requirements: The substrate must be clean and capable of bearing a load. The substrate must be level.
- Preparations: Level off and even out highly uneven substrates – use SP Level to close up joints and even out surfaces.
- Pre-wet the substrate. Apply SLP Fix as a scratch coat on the rear face of the board and on the substrate. Using a toothed spatula, apply SLP Fix wet-on-wet to the rear face of the panel and to the substrate. Position and press on the boards from the bottom up. Align using a floating rule.
- Mark the desired dimensions on the board. Cut using a jigsaw or hand-held circular saw. Rework the cut edges with a rasp or file if necessary. Avoid cross joints. Make sure that full-surface bonding is achieved.
- Dry and frost-free.
Tüketim bilgisi mevcut değil.
- Current regulations and legal requirements must be taken into account and deviations from these must be agreed separately. The relevant test certificates must be observed when planning and carrying out work.
- The product must be disposed of in accordance with the official regulations.